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Michelman Highlighting Complete Range of In-Line Primers for HP Indigo Labels and Packaging Presses at Dscoop 2016

Thursday, Apr 07, 2016
Michelman Highlighting Complete Range of In-Line Primers for HP Indigo Labels and Packaging Presses at Dscoop 2016

Michelman will introduce Dscoop EMEA 2016 and Dscoop North America 2016 visitors to its broad line of in-line primers formulated specifically for use with HP Indigo digital presses for  labels and packaging. Michelman’s family of primers are used by digital press owners to improve ink receptivity, rub resistance and image quality on most types of paper, plastic and film.

DigiPrime® 050 is a primer formulated for use in the priming and unwinding unit (PUW) of the HP Indigo 20000, a press designed to print on reel-based flexible packaging substrates, labels and shrink sleeves. Michelman’s primer enhances adhesive bond strength between film layers, and can be used on conventional adhesive laminated structures.

DigiPrime 060 is an in-line primer for the HP Indigo 30000, a sheet-fed press designed to print on folding cartons. Michelman’s DigiPrime 060 is designed to enhance ink adhesion on the substrate, and will not interfere with converting operations including erection of the carton, gluing, date coding and bar coding.

DigiPrime 680 and Michem® In-Line Primer 030 are formulated specifically for use in the in-line priming (ILP) unit of the HP Indigo WS6X00 series and the new HP Indigo 8000 digital presses. DigiPrime 680 is particularly effective for flexible packaging printing applications and improves ink receptivity on most types of film, exhibits good lamination bond strength, and improves printing performance on shrink sleeves. Michem In-Line Primer 030 is suited for most label substrates.

Michelman offers a full line of water-based primers and overprint varnishes formulated to allow HP Indigo users to get the most out of their presses. In addition to the primers, Michelman offers DigiGuard® overprint varnishes that enhance print quality and protect printed materials.

At Dscoop EMEA, being held April 5-9 in Tel Aviv, Israel, Michelman will exhibit at booth #G25 at the Convention Center, and booth L5 at the HP Campus Kiryat Gat. At the Dscoop North America Conference being held April 14-16 in San Antonio, Texas, Michelman will exhibit in booth #351.

 

Source : michelman.com

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