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Heart Failure Management Conference Spanish Packaging Firm LINPAC Invests €8 Million to Meet Escalating Demands of PET

LINPAC is addressing the growing demand for PET and rPET by investing in excess of €8m in new extrusion and thermoforming capacity in Pravia, Spain.The installation of a fourth extruder at its Pravia, Spain site will allow the food packaging manufacturing site to increase its capacity by 25 per cent in order to meet demand from retailers and packers across Europe who are making the transition from EPS and PP to PET packaging... more...

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Semi Automatic Strapping Machine
Pneumatic manipulator
Pneumatic manipulator PN series can be designed according to the ATEX regulations regarding applications in controlled environments with danger of explosion, classified classes 1 and 2 (Gas). They feature pneumatic control and drive. They can be rail or column or ceiling mounted...


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DataLase Variprint
This is a new innovative digital printing platform which combines DataLase core colour-change technology with the next generation of ultra high performance lasers. A breakthrough in inline laser digital printing, this new high-speed solution has a mono chrome colour additive that enables...


LDPE Shrink Flat Film
Wing Servo Auger Filler
Nichrome’s WING Servo Auger filling series of machines offer an efficient packaging solution for the most complex and versatile packaging applications. Its PLC based machine offers a sturdy performance and designed to last longer. A multi-featured controller allows packing...


Industry Updates
Packaging Products, Toray Plastics Develop PVdC-free packaging for Utz Quality Foods
US-based flexographic printing and converting solution provider Packaging Products (PPC), in partnership with Toray Plastics (America), has developed high-barrier PVdC-free packaging for US based firm Utz Quality Foods.The new packaging lamination is a combination of Toray's Torayfan CBS2 BOPP film and co-extruded BOPP print web...
Press Releases
Amkor and Cadence to Develop Packaging Assembly Design Kits for Amkor’s SLIM and SWIFT Packaging Technologies
Amkor Technology, Inc., a leading outsourced semiconductor packaging and test service provider, today announced the expansion of its collaboration with Cadence Design Systems, Inc. (NASDAQ: CDNS) to streamline semiconductor...
Events and Exhibitions
Expo Pack Mexico
17th May 2016 - 20th May 2016

Expo Bancomer Santa Fe
Packaging Machinery Manufacturers Institute
Afro Packaging & Food Exhibition 2016
26th May 2016 - 29th May 2016

Cairo International Convention & Exhibition Center,Egypt
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