Industry Press Releases

Amkor Technology Takes Leadership Position in Advanced System-in-Package Market

Thursday, Mar 24, 2016
Amkor Technology Takes Leadership Position in Advanced System-in-Package Market

Amkor Technology Inc., a leading semiconductor packaging and test service provider, today announced it has shipped 700 million RF and front-end advanced system-in-package (SiP) modules for mobile device applications. This achievement establishes Amkor’s leadership in delivering low-cost, high-performance advanced SiP solutions.

“Reaching this milestone affirms our leadership role in advanced SiP technologies,” said Steve Kelley, CEO and President of Amkor Technology Inc. “Our broad technology portfolio and engineering talent make Amkor an excellent choice for customers seeking high-performance, miniaturized solutions. In addition to building today’s laminate-based SiPs, we are also developing wafer-level SiP technology to enable the next generation of thinner, higher-performance electronic products.”

An advanced SiP module is composed of multiple semiconductor components with different functionalities which are combined into a single integrated circuit ("IC") package. Advanced SiPs allow designers to squeeze more functionality into a smaller space, while increasing system performance and lowering system power consumption. Advanced SiPs use a variety of interconnect technologies including wire-bond, flip chip, copper pillars and through silicon vias (TSVs).

Amkor’s laminate-based SiPs are manufactured in high volumes and have fast cycle-time, making them very cost-effective. The company’s wafer-based Silicon Wafer Integrated Fan-out (SWIFT™) and Silicon-less Integrated Module (SLIM™) technologies provide thinner packages at finer line/space geometries and higher densities than laminate-based SiPs. Both SWIFT and SLIM offer a lower-cost alternative to TSV-based 2.5D and 3D packaging.

About Amkor Technology Inc.

Amkor Technology Inc. is one of the world’s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world’s leading semiconductor companies, foundries and electronics OEMs. Amkor’s operational base encompasses more than 8 million square feet of floor space, with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. For more information, visit


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Greg Johnson
Senior Director, Finance and Investor Relations
Amkor Technology

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