Interpack China 2026

Press Releases & Industry Announcements

Explore the latest company announcements, product launches, sustainability initiatives, packaging innovations, partnerships, and manufacturing developments from the global packaging & labelling industry.

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6172 Press Releases Found
Outlook on the Flexible Packaging Global Market to 2026 - Increasing Adoption of Flexible Packaging Presents Opportunities

Dublin, March 26, 2021 (GLOBE NEWSWIRE) -- The ...

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CamScanner Calls Users to Participate in Earth Hour 2021

NEW YORK, March 26, 2021 (GLOBE NEWSWIRE) -- Popular document scan...

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6 Best Research Paper Writing Services in the U.S.

SEATTLE, March 26, 2021 (GLOBE NEWSWIRE) -- Stressays conducted...

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Dantex Group takes plate processing to a new level

Specialist photopolymer plate material and processing equipment supplier, Dantex Group, announces the launch of Marathon; a new plate processor,specifically aimed at the growing demands of the meta...

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Digicon 3 investment helps Limpet Labels Maximize growth opportunities

Leading print finishing equipment manufacturer, A B Graphic International (ABG), has recently supplied Wrexham-based Limpet Labels with a highly specified Digicon Series 3 finishing system. The inv...

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Damm and Ball launch world's first Aluminium Stewardship Initiative certified beverage cans

Damm, a leading beverage company in Spain, and a major player in the food, hospitality, logistics and distribution industries, has achieved ASI (Aluminium Stewardship Initiative) Performance Standa...

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Prepreg Market by Type of Reinforcement, Resin Type, Form, Manufacturing Process, Application and Region - Global Forecast to 2025

Dublin, March 25, 2021 (GLOBE NEWSWIRE) -- The ...

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Global Wall Coverings Market Report 2021: Market is Projected to Exceed $41 Billion by 2024 - Latest Trends Help Wall Coverings Market to Climb the Wall & Stand Tall

Dublin, March 25, 2021 (GLOBE NEWSWIRE) -- The ...

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Smurfit Kappa Bag-in-Box introduces new compact film

Smurfit Kappa Bag-in-Box makes another step towards circular economy and reduces the amount of plastic used to manufacture bags by introducing the new light 60-micron EVOH film – E Compact 60...

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Intevac Announces MATRIX Order for Fan-Out Applications in the Advanced Semiconductor Packaging Market

Intevac, Inc., a leading supplier of thin-film processing systems, today announced an INTEVAC MATRIX® PVD order for fan-out applications in the advanced semiconductor packaging market. This ord...

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