The Fraunhofer Institute for Process Engineering and Packaging IVV has developed new ultra barrier films for the flexible encapsulation of organic electronics (OEs).
Currently, the facility for coating films by atomic layer deposition (ALD) is being constructed at the institute.
The plant will allow the institute to further reduce the permeability of films and provide new film products to industry.
ALD technology is suitable for roll-to-roll processes, as it enables high production efficiency.
Its processing speed will be similar to the current vacuum processes, which are used to produce the highest barrier films.
According to the institute, minimizing the permeability to water vapor and oxygen is the key to further successful optimization of high barrier films.
The institute will provide the new technology for publicly funded R&D projects, which will provide industry with customized solutions and R&D services in the area of process and material development.
The new ultra barrier films will be exhibited at the international LOPEC fair in Munich, Germany, which will be held from 6 to 7 April.
Source : closures.packaging-business-review.com