GE Ventures has entered into a multi-year and global microelectronics packaging patent agreement with Samsung Electro-Mechanics (SEMCO).

As part of the deal, SEMCO will license GE microelectronics packaging patent portfolio, enabling to cover fabricating substrates embedded with electronic circuits.

The patent portfolio is mostly suitable for high performance communication and mobility products.

The portfolio is developed by GE Global Research and Imbera Electronics Oy, which is currently known as GE Embedded Electronics Oy.

GE Ventures helps its partners to accelerate innovation and growth by offering access to GE technologies through licensing and joint development partnerships.

The company is licencing its advanced microelectronics packaging technology for global manufacturing partners to provide effective solutions for the businesses across the globe.

SEMCO supplies passive components for multiple industry sectors. It operates three divisions, including digital module, advanced circuit interconnect and LCR.

GE Ventures microelectronics packaging program director and vice president Lawrence Davis said: “GE is extremely pleased that SEMCO has recognized the significance of GE’s IP in this space.

“As the demand for increased power efficiency and higher performance in mobility products continues to expand, GE is positioned to be a strong partner for embedded electronics technology in the power and consumer electronics space.”

 

Source:packaging-business-review.com

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