Optomec, a leading global supplier of production grade additive manufacturing (AM) systems, today announced the Aerosol Jet HD System designed to address today’s most demanding electronics packaging challenges - the increasing density of electronic components. The Aerosol Jet HD System is a compact, configurable production platform that can dispense a wide range of electronics materials with features as small as 20 microns. The system can also produce larger features, from hundreds of microns to millimeters, and print wide-area conformal coatings from 100 nanometers to tens of microns in thickness. The solution will be on display for the first time at IPC/APEX (Feb 27 - March 1, 2018 in Booth # 3800).

The Aerosol Jet HD System is based on Optomec's patented Aerosol Jet technology, a fine-feature material deposition solution used to directly print functional electronic circuitry and components onto low-temperature, non-planar substrates, without the need for masks, screens or subtractive post-processing. Based on the next-generation of Optomec’s production-proven Aerosol Jet print engine, coupled with in-line automation, the HD System can handle a variety of substrate sizes and compositions, providing high-resolution printed electronics for today’s most demanding advanced packaging applications such as 3D interconnects, conformal RF/EMI shielding, and precision micro-dispense of insulators and adhesives.

“The demand for miniaturization of electronic systems, especially in mobile device, medical and mil-aero applications, has exposed a technology gap in advanced electronics packaging that current dispense solutions cannot address. With this announcement, Optomec offers a practical, seamless and cost-effective solution that can deliver an order of magnitude improvement in dispense resolution, addressing the advanced packaging needs of today and providing a pathway far into the future,” said Dave Ramahi, CEO, of Optomec.

The compact, modular design of the Aerosol Jet HD System enables it to easily plug into almost any existing manufacturing environment to fill production gaps and provide new capabilities. The solution provides a turn-key approach to advanced electronics packaging with the Aerosol Jet Print Engine and tool path generation software integrated into a standard dispense automation platform. For more information, click here.

In addition, production-ready recipes for a range of conductive, dielectric, adhesive and other materials, capable of extended runtimes and high yields are available with the initial product release.

 

Source: businesswire.com

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