PARIS, Nov. 6, 2019 /PRNewswire/ -- With Born2Bond™, Bostik brings a new range of innovative engineering adhesives designed for 'by-the-dot' bonding applications in selected industries, such as automotive, electronics, luxury packaging, medical devices, and MRO. Read more...
At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging electronic and photonic chips, and wafer-level packaging. This advanced die bonder is based upon MRSI's field proven high-speed HVM die bonder platform for high-volume manufacturing of integrated photonics that requires ultimate accuracy at the submicron level. It has inherited the speed using multiple levels of parallel processing Read more...
