Industry Press Releases

Global 3D Semiconductor Packaging Market Forecasts to 2023 - Research and Markets

Thursday, Dec 07, 2017

The "Global 3D Semiconductor Packaging Market Research Report Insights, Opportunity Analysis, Market Shares and Forecast 2017 - 2023" report has been added to Research and Markets' offering.

The market is majorly driven by the rising trend of miniaturization of electronics devices. Need for designing cost effective chips plays a major role in overall price of electronic devices. However, thermal issues in devices due to high level integration and high unit cost of 3d packaging are restraining the growth of market.

Global 3D semiconductor market is growing steadily with the increase in the sales of microelectronics and consumer electronic. With the advancement in the consumer electronics sector as the emergence of 3D TVs and ultra-high definition TVs and hybrid laptops the demand for semiconductor ICs will increase.

Market Drivers

•  Rising Demand for Advanced Architecture in Electronic Products
•  Rising Trend of Miniaturization of Electronics Devices
•  Increasing Market for Electronic Devices
•  Technological Advancements

Market Restraints

•  Thermal Issues in Devices Due to High Level Integration
•  High Unit Cost of 3D Packaging

Market Opportunities

•  Increasing Adoption of High-End Computing, Servers, And Data Centers
•  Rising Internet of Things (IoT) Trend

Market Challenges

•  Effective Supply Chain Management
•  Initial Capital Investment Required to Set Up a Plant is High

The overall demand for 3D semiconductor packaging has been exceptionally high in Asia Pacific. This region in terms of growth is expected to lead the market forecast period. Followed by North America and Europe, which continue their constant increase in demand for 3D semiconductor packaging as the market in both regions is considered mature. A great deal of manufacturers holds capacities in Asia Pacific, which makes it leading region in the market currently.

Key Topics Covered:

1. Introduction

2. Market Overview

3. Market Determinants

4. Market Segmentation

5. Competitive Landscape

6. Geographic Analysis

7. Company Profiles

  •  Advanced Micro Devices, Inc (U.S.)
  •  Amkor Technology (U.S.)
  •  Ase Group (Taiwan)
  •  Broadcom Ltd. (Singapore)
  •  IBM (U.S.)
  •  Intel Corporation. (U.S.)
  •  Jiangsu Changjiang Electronics Technology Co., Ltd (China)
  •  Qualcomm Technologies Inc (U.S.)
  •  Samsung Electronics Co. (South Korea)
  •  Siliconware Precision Industries Co., Ltd (Taiwan)
  •  Sony Corp. (Japan)
  •  Stmicroelectronics Nv (Switzerland)
  •  Taiwan Semiconductor Manufacturing Company Limited (Taiwan)
  •  Toshiba Corp. (Japan)
  •  United Microelectronics Corp. (Taiwan)

For more information about this report visit https://www.researchandmarkets.com/research/lnrwtc/global_3d

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Source: businesswire.com

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