Technavio has announced the top seven leading vendors in their recent global semiconductor packaging materials market report. This research report also lists 36 other prominent vendors that are expected to impact the market during the forecast period.
Competitive vendor landscape
The global semiconductor packaging materials market is highly fragmented. There are many diversified multinational, regional, and local vendors in the market. The majority of the market is concentrated in APAC. “The local players have raised the bar by offering innovative solutions at a lower price than the international players by backtracking and re-engineering the processes used by them. This is leading to price wars and forcing bigger players to introduce innovative solutions,” says Sharan Raj, a lead analyst at Technavio for packaging.
The smaller local vendors compete in terms of cost as it is difficult for them to compete with international vendors in terms of quality, features, and range of offerings. However, as there is an increase in automated line production facilities worldwide, vendors are finding that there is huge scope for innovation in material handling. It is expected that the international players will grow inorganically during the forecast period by acquiring regional or local players.
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Top seven semiconductor packaging materials market vendors
Amkor Technology was founded in 1968 and is headquartered in Tempe, Arizona, US. The company offers advanced semiconductor assembly and test services. The company also provides a wide range of services, which includes package design and development, wafer bumping and redistribution services, wafer probe, assembly, and final test. For FY2015, the company reported revenue of USD 2.88 billion.
DuPont was founded in 1802 and is headquartered in Wilmington, Delaware, US. The company provides a wide range of products for the agriculture, automotive, building and construction, chemicals, electronics, food and beverage, energy, public sector and government, healthcare and medical, marine, and packaging industry. For the FY2015, the company generated revenue of USD 25.13 million.
Henkel was founded in 1876 and is headquartered in Düsseldorf, Germany. It specializes in laundry and home care, adhesive technology, and beauty care businesses worldwide. Some of its brands include Persil, Schwarzkopf, and Loctite. It has more than 8,150 patents worldwide. For the FY2015, the company reported a revenue of USD 20.07 billion.
Hitachi Chemicals was founded in 1962 and is headquartered in Tokyo, Japan. The company produces and distributes electronic-related products and advanced performance products. Its product portfolio includes printed wiring boards and related products, semiconductor and display related materials, carbon and ceramic, functional films, and automotive products. For the FY2015, the company reported a revenue of USD 4.38 billion.
Honeywell International was incorporated in 1906 and is headquartered in Morris Plains, New Jersey, US. It is a diversified technological and manufacturing company, which provides aerospace products and services; turbochargers, control, sensing, and security technologies; electronic and advanced materials; and energy efficient products and solutions for homes, business, and transportation industries worldwide. For the FY2015, the company reported revenue of USD 38.58 billion.
Kyocera was founded in 1959 and is headquartered in Kyoto, Japan. It is a manufacturer of electronic components and equipment. The company is involved in the manufacture and distribution of wide range of products, including materials, components, devices and equipment, and related services. Its product portfolio consists of semiconductor parts, electronic devices, ceramic components, telecommunications and information equipment as well as others.
Toppan Printing was established in 1990, and is headquartered in Tokyo, Japan. It is a global provider of print technologies and services. For the FY2015, the company generated revenue of USD 12.71 billion.
The company through its electronics segment provides display and semiconductor related products on the basis of technology capabilities. Under its semiconductor related products, the company offers photomasks for semiconductors, lead frames, large scale integration services and design, flip chip-ball grid array substrates, and on-chip color filter arrays. In Late 2014, the company installed new production equipment for flip chip-ball grid array substrates at its Niigata Plant, Japan.
Browse Related Reports:
Global Semiconductor Fabrication Material Market 2016-2020
Global Semiconductor Materials Market 2015-2019
Global Semiconductor Packaging and Assembly Equipment Market 2016-2020
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Technavio analysts employ primary as well as secondary research techniques to ascertain the size and vendor landscape in a range of markets. Analysts obtain information using a combination of bottom-up and top-down approaches, besides using in-house market modeling tools and proprietary databases. They corroborate this data with the data obtained from various market participants and stakeholders across the value chain, including vendors, service providers, distributors, re-sellers, and end-users.
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Source : businesswire.com