ASMPT AMICRA, a global leader in ultra-high precision die attach equipment specializing in precise die attach solutions, and Teramount Ltd, a frontrunner in scalable fiber connectivity to chips, have unveiled a collaborative effort to tackle the challenge of connecting fibers to silicon photonic chips. This partnership aims to address the ever-increasing bandwidth demands in datacom and telecom applications, especially within the rapidly advancing fields of artificial intelligence and high-performance networking.

Achieving seamless fiber-to-chip connectivity has been a significant hurdle in these industries, and the collaboration between ASMPT AMICRA and Teramount promises a groundbreaking solution. It involves the integration of Teramount's pioneering wafer-level self-aligning optical elements onto customers' Silicon Photonics wafers using ASMPT AMICRA's advanced precision die attach machinery.

Hesham Taha, President and CEO of Teramount, emphasized the market demand for high-volume Silicon Photonics manufacturing and packaging, stating, "They are keen to see this supported by equipment that’s already used in high volume OSAT environments. ASMPT AMICRA, a front-runner in die-to-wafer attach equipment, is an ideal partner for Teramount to scale up and meet this rising customer demand."

Dr. Johann Weinhaendler, Managing Director of ASMPT AMICRA, highlighted the importance of Silicon Photonics in our future daily lives and the necessity for increasingly accurate assembly of semiconductor components in light of the constant growth in data transfer. He noted, "In Teramount, we see an optimal expert in the development of high-speed connectivity solutions where we meet each other to incorporate their products via high-precision passive wafer-level assembly of optical lens components."

Teramount is known for its innovative Universal Photonic Coupler solution, which revolutionizes optical connectivity by enabling scalable connections between fibers and photonic chips. This solution aligns photonics with standard semiconductor high-volume manufacturing and packaging capabilities.

ASMPT AMICRA, based in Regensburg, Germany, is a global leader in ultra-high precision die attach systems, specializing in submicron placement accuracy. Their systems cater to the Silicon photonics and semiconductor advanced packaging market, supporting various processes such as die attach, flip chip, eutectic, epoxy, and Mass Transfer Printing (MTP).

ASMPT AMICRA operates as a subsidiary of ASMPT Limited (HKEX stock code: 0522), a leading global supplier of hardware and software solutions for the semiconductor and electronics manufacturing industry, with its headquarters in Singapore.

About Teramount: Teramount is reshaping the optical connectivity landscape with its innovative solution for connecting optics to silicon in data centers, advanced computing, sensors, and other datacom and telecom applications. Their Universal Photonic Coupler solution provides scalable connectivity between fibers and photonic chips, aligning photonics with the high-volume manufacturing and packaging capabilities of standard semiconductors. Teramount is headquartered in Jerusalem, Israel. For more information, please visit www.teramount.com.

About ASMPT AMICRA: ASMPT AMICRA, headquartered in Regensburg, Germany, is a leading global supplier of ultra-high precision die attach systems. ASMPT AMICRA systems specialize in submicron placement accuracy (±0.2µm@3s) for the Silicon photonics and semiconductor advanced packaging market. They support die attach, flip chip, eutectic, epoxy, and Mass Transfer Printing (MTP) processes.

ASMPT AMICRA operates as a subsidiary of ASMPT Limited (HKEX stock code: 0522), a prominent global provider of hardware and software solutions for semiconductor and electronics manufacturing, with its headquarters in Singapore.

 

Source:businesswire.com

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