CyberOptics® Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will unveil the new Multi-Reflection Suppression™ (MRS™)-enabled 3D and 2D WX3000 Metrology and Inspection systems for wafer-level and advanced packaging applications at the virtual SEMICON West show, July 20-23rd. Incorporating the NanoResolution MRS sensor, the WX3000 Metrology and Inspection systems enable the ultimate combination of high speed, Read more...
At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging electronic and photonic chips, and wafer-level packaging. This advanced die bonder is based upon MRSI's field proven high-speed HVM die bonder platform for high-volume manufacturing of integrated photonics that requires ultimate accuracy at the submicron level. It has inherited the speed using multiple levels of parallel processing Read more...
