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SIOUX FALLS, S.D., April 23, 2019 (GLOBE NEWSWIRE) -- Raven Industries (NASDAQ:RAVN) today announced that its Engineered Films division has completed the installation and qualification of an advanced seven-layer barrier extrusion line, referred to as Line 15. This new production line is located in Raven’s state-of-the-art Read more...

EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced NanoCleave™, a revolutionary layer release technology for silicon that enables ultra-thin layer stacking for front-end processing, including advanced logic, memory and power device formation, as well as semiconductor advanced packaging. NanoCleave is a fully front-end-compatible layer release technology that features an infrared (IR) lase Read more...