Camtek Receives $9 Million Order From A Leading OSAT For The Inspection Of Advanced Interconnect Packaging
8 December 2020
Camtek Ltd., announced that it received an order totaling $9 million for the inspection of Advance Interconnect Packaging from a leading OSAT.
The systems are expected to be delivered during the second quarter of 2021.
Rafi Amit, Chief Executive Officer, commented, "Advanced Interconnect Packaging enables applications that require high performance, low power consumption and improved dimensions (such as 5G, processors and memory devices). Camtek's inspection systems support the manufacture of Advanced Interconnect Packaging by providing our customers with high throughput, superior detectability and excellent return on investment (ROI). I am happy to continue delivering best-in-class inspection and metrology solutions to the industry's leading OSATs.
"This order is another vote of confidence in our systems, which have become the industry standard for the inspection and metrology of Advanced Interconnect Packaging."
ABOUT CAMTEK LTD.
Camtek is a leading manufacturer of metrology and inspection equipment and a provider of software solutions serving the Advanced Interconnect Packaging, Memory, CMOS Image Sensors, MEMS, RF and other segments in the mid end of the semiconductor industry.
Camtek provides dedicated solutions and crucial yield-enhancement data, enabling manufacturers to improve yield and drive down their production costs.
With eight offices around the world, Camtek has best-in-class sales and customer support organization, providing tailor-made solutions in line with customers' requirements.
This press release is available at www.camtek.com
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