InterPACK is the leading global forum for cutting‑edge research, development, manufacturing, and applications in electronics packaging and heterogeneous integration.
As the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD), InterPACK brings together the full systems ecosystem — from advanced materials and thermal management to next‑generation computing architectures and intelligent, connected devices. The program spans Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Additive and Printed Electronics, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid, and Electric Vehicles.
InterPACK's international community is one of its greatest strengths. The conference fosters meaningful collaboration among industry leaders, academic researchers, national laboratories, funding agencies, start‑ups, and entrepreneurs. Alongside technical paper presentations and exhibits, InterPACK 2026 will feature panel discussions, workshops, tutorials, keynote and technology talks from distinguished experts, and a joint poster session uniting industry, national labs, and academia.
