Leading figures from Haleon, Tata Consumer Products, McCormick and GS1 have called for a greater focus on practical implementation, real-world production challenges and end-to-end packaging solutions as they helped shape the future of Empack, the UK’s event for packaging machinery and processing technology.
Meeting at Walpole's headquarters in London, the Empack Advisory Board brought together experts spanning packaging engineering, manufacturing, process optimisation and digital standards to discuss the issues that will define the next generation of packaging production and how Empack 2027 can best support the industry through a period of unprecedented change.
While regulation, automation and artificial intelligence dominated much of the conversation, one message emerged consistently throughout the morning. The industry no longer needs more discussion about what is changing. It needs practical guidance on how to successfully implement those changes across the production line.
Chaired by Jo Stephenson, Managing Director of Think B2B Marketing, the Board included Olumide Ojo-Oratokhai, Packaging Engineer at Tata Consumer Products (Lavazza Coffee); Ian Stapleton, Technical Packaging Manager, CMO EU Packaging Engineering at Haleon; Raut Kaustubh Vilas, Process Engineer at McCormick; and Camilla Young, Programme Lead – QR Codes at GS1. Together, they explored how Empack can better support packaging manufacturers, engineers, operations teams and brand owners as they navigate increasingly complex production challenges.
The implementation of the Packaging and Packaging Waste Regulation (PPWR) emerged as one of the industry's most pressing priorities. Rather than focusing solely on regulatory requirements, Board members highlighted the need for practical examples that demonstrate how material choices, processing technologies, machinery, and automation combine to deliver compliant, commercially successful packaging solutions. Live production demonstrations, end-to-end case studies and real implementation stories were all identified as valuable opportunities for future editions of the event.
The discussion also reflected the rapidly evolving role of technology across packaging manufacturing. Artificial intelligence, digitalisation, cybersecurity, connected packaging, and QR code adoption were all highlighted as areas where packaging professionals are seeking practical insight rather than theoretical debate. Members agreed that visitors increasingly want to understand not only which technologies are emerging, but how they can be integrated into existing production environments to improve efficiency, resilience and decision-making.
Jo Stephenson, Chair of the Empack Advisory Board and Managing Director of Think B2B Marketing, said: "The conversations around the table reflected an industry that's moving beyond theory. Packaging professionals understand the challenges ahead, whether that's PPWR, digitalisation or AI. What they're looking for now is practical guidance that helps them implement change with confidence. That's exactly the role Empack should play. By bringing together the people developing new technologies with the engineers, manufacturers and operations teams responsible for delivering them, we can help turn innovation into real-world progress."
The recommendations gathered during the Advisory Board meeting will now help shape Empack 2027, from its conference programme and live demonstrations to the partnerships and experiences delivered across the exhibition. Central to that vision is strengthening collaboration across the packaging production journey, creating more opportunities for machinery suppliers, material specialists, packaging engineers, brand owners and operations teams to share knowledge, solve common challenges and accelerate the adoption of practical innovation. In doing so, Empack will continue to reinforce its position as the UK's event for packaging machinery and processing technology, where production professionals can experience the future of production, today.
Packaging Innovations & Empack 2027 will take place 24 & 25 February next year at the NEC.
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